By K. L. Mittal, Tanweer Ahsan
This complete booklet will supply either basic and utilized features of adhesion bearing on microelectronics in one and simply available resource. one of the issues to be coated include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of fabrics because it relates to adhesion
- Surface cleansing because it relates to adhesion
- Ways to enhance adhesion
- Unraveling of interfacial interactions utilizing an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to varied substrates
- Adhesion of skinny films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of other dielectric materials
- Delamination and reliability matters in packaged devices
- Interface mechanics and crack propagation
- Adhesion dimension of skinny movies and coatings
Read or Download Adhesion in Microelectronics PDF
Similar microelectronics books
Integrating actual modeling, mathematical research, and laptop simulation, Instrumentation layout stories explores a wide selection of particular and sensible instrumentation layout events. the writer makes use of MATLAB® and SIMULINK® for dynamic procedure simulation, Minitab® for statistical functions, and Mathcad for common engineering computations.
Reliability of Microtechnology discusses the reliability of microtechnology items from the ground up, starting with units and increasing to platforms. The book's concentration contains yet isn't constrained to reliability problems with interconnects, the technique of reliability suggestions and normal failure mechanisms.
Creation to Fiber Optics is easily proven as an introductory textual content for engineers, managers and scholars. It meets the desires of structures designers, install engineers, digital engineers and someone else seeking to achieve a operating wisdom of fiber optics with at the very least maths. evaluation questions are incorporated within the textual content to permit the reader to envision their realizing as they paintings during the booklet.
The PICAXE microcontroller is a cheap tiny laptop sitting in a microchip. it may be programmed through you to manage instruments, your innovations or your creations and the checklist of those are unending. Your rules or mind's eye is your merely proscribing issue. Alarm structures, keypad access structures, digital cube, video games and color sensors are yet a number of.
- Mixed-signal circuits
- Nanodevices for Photonics and Electronics
- Defects in Semiconductors, Volume 91
- MEMS Cost Analysis: From Laboratory to Industry
- Nanoscale Transistors: Device Physics, Modeling and Simulation
Extra info for Adhesion in Microelectronics
Affrossman, I. R. Dunkin, R. A. Pethrick, and C. J. Shields, Adsorption of simulated epoxy resin fragments: IETS and matrix Study of Molecular Bonding or Adhesion 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. r. study of an adduct of n-propylamine and 1,2-epoxy butane, Spectrochim. Acta, 40B, 847–851 (1985). S. D. Senturia, Polyimides in microelectronics, in: Polymers for High Technology, Electronics and Photonics, M. J. Bowden and S. R. ), pp 428–436, American Chemical Society, Washington DC (1987).
Sci. , 102, 8838–8843 (2005). A. Troisi and M. A. Ratner, Propensity rules for inelastic electron tunneling spectroscopy of single-molecule transport junctions, J. Chem. , 125, 214709–214709-11 (2006). 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics. , Sunnyvale, CA, USA Abstract Microelectronic devices and packages represent a most important class of complicated adhering systems made of multilayer dissimilar film stacks, the integrity and reliability of which depend on the cohesive strength as well as on the interfacial adhesion of films.
Consequently, the measured adhesion in a specific experiment, i. e. the interface strength or interface toughness. g. thickness, mechanical properties, and residual stresses in the coating. However, due to the difficulty to quantify or subtract the contributions of the “many other factors”, it is often very difficult to extract the value of fundamental adhesion from the measured practical adhesion value. Practical adhesion is measured broadly speaking in two ways: t Force or the work required to separate the coating from the substrate, with the locus of failure either at the interface or in the interphase, instead of within the coating or the substrate.