Download Adhesion in Microelectronics by K. L. Mittal, Tanweer Ahsan PDF

By K. L. Mittal, Tanweer Ahsan

This complete booklet will supply either basic and utilized features of adhesion bearing on microelectronics in one and simply available resource. one of the issues to be coated include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of fabrics because it relates to adhesion
  • Surface cleansing because it relates to adhesion
  • Ways to enhance adhesion
  • Unraveling of interfacial interactions utilizing an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion  (metallized polymers)
  • Polymer adhesion to varied substrates
  • Adhesion of skinny films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of other dielectric materials
  • Delamination and reliability matters in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion dimension of skinny movies and coatings

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Extra info for Adhesion in Microelectronics

Example text

Affrossman, I. R. Dunkin, R. A. Pethrick, and C. J. Shields, Adsorption of simulated epoxy resin fragments: IETS and matrix Study of Molecular Bonding or Adhesion 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. r. study of an adduct of n-propylamine and 1,2-epoxy butane, Spectrochim. Acta, 40B, 847–851 (1985). S. D. Senturia, Polyimides in microelectronics, in: Polymers for High Technology, Electronics and Photonics, M. J. Bowden and S. R. ), pp 428–436, American Chemical Society, Washington DC (1987).

Sci. , 102, 8838–8843 (2005). A. Troisi and M. A. Ratner, Propensity rules for inelastic electron tunneling spectroscopy of single-molecule transport junctions, J. Chem. , 125, 214709–214709-11 (2006). 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics. , Sunnyvale, CA, USA Abstract Microelectronic devices and packages represent a most important class of complicated adhering systems made of multilayer dissimilar film stacks, the integrity and reliability of which depend on the cohesive strength as well as on the interfacial adhesion of films.

Consequently, the measured adhesion in a specific experiment, i. e. the interface strength or interface toughness. g. thickness, mechanical properties, and residual stresses in the coating. However, due to the difficulty to quantify or subtract the contributions of the “many other factors”, it is often very difficult to extract the value of fundamental adhesion from the measured practical adhesion value. Practical adhesion is measured broadly speaking in two ways: t Force or the work required to separate the coating from the substrate, with the locus of failure either at the interface or in the interphase, instead of within the coating or the substrate.

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